A revolutionary wafer-scale AI architecture designed to break the memory wall and push the boundaries of AGI evolution.

With 500GB of silicon-layer high-bandwidth memory, hybrid-bonded logic-memory stacking, and Wafer-on-Wafer (WoW) technology, WISE seamlessly integrates compute and memory at the wafer level, delivering unprecedented efficiency, scalability, and AI acceleration. By eliminating traditional memory bottlenecks and maximizing parallelism, WISE sets a new standard in high-performance AI computing—powering the next generation of LLMs, VLMs, robotics, and AGI workloads.