WISE

WISE (Wafer-Intelligent Stacking Engine) for AGI Evolution

WISE Turnkey Solution – Next-Generation AI AccelerationThe WISE (Wafer-Intelligent Stacking Engine) turnkey solution is a breakthrough AI acceleration platform that integrates wafer-scale memory, advanced interconnects, and thermal management to deliver unprecedented efficiency and scalability for AGI workloads, LLMs, VLMs, robotics, and large-scale computing.

Wafer-Scale High-Bandwidth Memory

Multiple wafer-scale stacked memory layers for ultra-fast data access and low-latency AI computation.

Wafer Level Cross-Die Connection

High-speed interconnects enabling seamless data movement across compute layers.

Wafer Silicon Packaging

Cutting-edge fabrication techniques for scalable AI deployment and power efficiency.

Wafer-on-Wafer (WoW) Technology

Stacked wafer integration for dense compute and memory fusion.

Advanced Heat Dissipation

Efficient thermal management for maximized performance and reliability.

WISE

Wafer-Intelligent Stacking Engine Turnkey Solution

With the WISE (Wafer-Intelligent Stacking Engine) turnkey solution, EinsNeXT delivers a ready-to-integrate AI silicon platform that eliminates traditional memory bottlenecks while scaling compute density to unprecedented levels.

Whether for LLM fine-tuning, AGI evaluation, or robotics AI, WISE sets a new standard in high-performance AI acceleration.